EPOXY, POLYURETHANE OR SILICONE
Each potting material offers specific advantages for the protection of electronic assemblies.
Dipotec has many years of experience in processing all common potting materials and provides the appropriate dispensing and potting technology for prototypes, pre-series projects and series production.
EPOXY RESIN: ROBUST MATERIAL FOR VERSATILE APPLICATIONS
Epoxy resins are among the most widely used materials for electronic potting and encapsulation, including contract potting services. They are characterized by high mechanical strength, excellent electrical insulation properties, and outstanding resistance to many chemicals and environmental influences.
Typical applications for epoxy potting include electronic and electrical components such as sensors, coils, capacitors, and power electronics. As a potting material, epoxy resin provides reliable protection against moisture, contamination, chemicals, and mechanical stress.
Key advantages of epoxy resins include high hardness, good temperature resistance, and excellent adhesion to a wide range of substrates. However, their comparatively high rigidity and the heat generated during the exothermic curing reaction, particularly in larger potting volumes, must be taken into account.
Contract Potting with Epoxy Resin
As a specialized potting service provider, Dipotec supports customers with tailored epoxy potting solutions for prototypes, pre-series projects, and series production. An additional post-curing process can further improve the degree of crosslinking and heat distortion resistance.
POLYURETHANE: ADAPTABLE MATERIAL FOR ELECTRONIC POTTING
Polyurethane potting compounds (PU) are among the most frequently used two-component materials in industrial applications, including contract potting services. Their broad property spectrum, ranging from hard to soft-elastic and from low-viscosity to highly thixotropic, allows them to be precisely tailored to specific application requirements.
Typical applications include the potting of sensors, transformers, capacitors, control units, and other electronic assemblies. Polyurethane provides reliable protection against moisture, dust, chemicals, and mechanical stress.
Advantages of polyurethane include good processability, low shrinkage, moderate flexibility, and comparatively low heat generation during curing. Compared with epoxy resins, PU systems are often better able to absorb movement and thermal stresses.
It should be noted that many PU systems are sensitive to moisture during processing. Even small amounts of moisture can affect the chemical reaction and lead to bubble formation.
Contract Potting with Polyurethane
: Dipotec processes PU potting compounds for prototypes, pre-series projects, and series production. Modern material preparation and dispensing systems ensure reliable processing, including the safe handling of moisture-sensitive casting resins.
SILICONE: HIGH-PERFORMANCE MATERIAL FOR DEMANDING POTTING APPLICATIONS
Silicones are a group of synthetic polymers with an exceptional range of properties. Silicone-based potting compounds are particularly characterized by their high temperature resistance and elasticity. Depending on the application and performance requirements, both one-component (1K) and two-component (2K) systems are available.
Due to their excellent electrical insulation properties, silicone-based casting resins play an important role in electronics manufacturing, for example in transformers and as thermally conductive potting compounds or adhesives. Their hydrophobic properties and high elasticity also make them suitable for demanding sealing applications in the automotive industry, lighting technology, and sensor applications. In addition, many silicone materials offer high optical clarity and light transmission. Thanks to their excellent UV, weathering, and aging resistance, they are frequently used for LED potting and optical applications.
A defining characteristic of cured silicone potting compounds is their high temperature resistance. Typical electronic potting silicones can be used continuously in temperature ranges from approximately -50°C to +200°C, with certain formulations capable of operating beyond these limits. They also offer excellent weather resistance and low heat generation during curing.
Typical characteristics of silicone materials include relatively low hardness and significantly higher gas and water vapor permeability compared with epoxy or polyurethane resins.
Contract Potting with Silicone
Dipotec processes silicone potting compounds for prototypes, pre-series projects, and series production. Silicone materials are particularly suitable for applications with high temperature requirements, severe thermal cycling, or sensitive electronic assemblies that require permanent elastic protection.